Work

Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3

Year: 2017

Type: article

Source: Journal of Electronic Materials

DOI: 10.1007/s11664-017-5777-1

Authors: Yu-Chen Tseng, Hsuan Lee, Nga Yu Hau, Shien-Ping Feng, Chih-Ming Chen

Institutions: National Chung Hsing University, University of Hong Kong

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Surfaces, Coatings and Films

Field: Materials Science

Domain: Physical Sciences

Open Access status: bronze

Funders: Industrial Technology Research Institute, Ministry of Science and Technology, Taiwan

Award: Systematic Study of Peculiar Effects of Additive Formula of Electroplating on the Microelectronic Solder Joints

OpenAlex ID: W2754748056

FWCI: 0.542

Cites: 30

Cited by: 11

Related to: 10