Work

The applications of FIB 3-point localization method in semiconductor failure analyses

Year: 2017

Type: conference-paper

Source: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

DOI: 10.1109/ipfa.2017.8060105

Authors: Ming He, Oliver Guo, Sean Wang, Peter Li, Mark Zhang, Wei-Ting Kary Chien, Ming Li

Institution: Semiconductor Manufacturing International (China)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2761726224

FWCI:

Cites: 4

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Related to: 10