Work

FIB & TEM application methods with related theory explanations

Year: 2017

Type: conference-paper

Source: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

DOI: 10.1109/ipfa.2017.8060137

Authors: Lingzhi Xie, Sunday Zheng, J. H. Lee, Ming Li, Mark Zhang, Kary Chien

Institution: Semiconductor Manufacturing International (China)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2763786147

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