Work

Experimental and modelling thermal study of a 3D-stacked silicon based LEDs array concept

Year: 2017

Type: conference-paper

Source: International Workshop on Thermal Investigations of ICs and Systems

DOI: 10.1109/therminic.2017.8233843

Authors: B. Chambion, B. Bouillard, A. Gasse, A. Vandeneynde, N. Ait-Mani, A. Gueugnot, D. Henry, F. Mercier, P. Rueda

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Laboratoire d'Électronique des Technologies de l'Information

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W2780218148

FWCI: 0.387

Cites: 12

Cited by: 1

Related to: 10