Fenton-Like Reaction between Copper Ions and Hydrogen Peroxide for High Removal Rate of Tungsten in Chemical Mechanical Planarization
Year: 2018
Type: article
Abstract: The Fenton reaction has been used for the tungsten oxidation under acidic conditions in tungsten chemical mechanical planarization (CMP). However, the narrow working pH window required for ideal reaction limits its application. Herein, we report a simple Fenton-like system via the reaction between copper ion and hydrogen peroxide (H 2 O 2 ) for the tungsten oxidation over a broad pH range. Copper ion was employed as a reactant with H 2 O 2 for the Fenton-like reaction, resulting in high production rates of hydroxyl radicals in the range of acidic to neutral pH, which leads to a high rate of tungsten oxidation. As a result, the Fenton-like reaction between copper ions and H 2 O 2 enables the high removal rates of tungsten films during CMP process in acidic to neutral pH ranges.
DOI: 10.1149/2.0131803jss
Authors: Kijung Kim, Kangchun Lee, Sounghyun So, Sungwook Cho, Myeongjae Lee, Keungtae You, Jinok Moon, Taeseup Song
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W2790429705