Work

Boron nitride encapsulated structure as efficient heat dissipation for nano-electronics

Year: 2018

Type: article

Source: Bulletin of the American Physical Society

Authors: Xian Zhang, Fan Ye, Philip X.‐L. Feng

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2792686897

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