Work

Low resistance metal interconnection for direct wafer bonding of electronic to photonic ICs

Year: 2017

Type: article

Source: TU/e Research Portal

Authors: Meighan, A, Wale, MJ Michael, Vries, T Tjibbe de, Smalbrugge, E Barry, Williams, KA Kevin

Institution: Eindhoven University of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2795317478

FWCI: 0.781

Cites:

Cited by: 8

Related to: 10