Modeling of Contact Stresses for Condition Monitoring Using Finite-Element Method and Semi-analytical Approach
Work
Year: 2018
Type: book-chapter
Source: Springer proceedings in physics
Cites: 9
Cited by:
Related to: 20
FWCI:
Citation percentile (by year/subfield):
Subfield: Mechanics of Materials
Field: Engineering
Domain: Physical Sciences
Open Access status: closed