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Design Considerations for Paralleling Multiple Chips in SiC Power Modules

Year: 2017

Type: article

Author: Fei Yang

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2800218967

FWCI: 0.562

Cites:

Cited by: 6

Related to: 10