Improved thermal stability of phenolic resin by graphene-encapsulated nano-SiO2 hybrids
Year: 2018
Type: article
Authors: Juan Chen, Wenbo Zhang, Jing Liu, Heyi Ge, Moufeng Tian, Jianye Liu, Min Jing
Institutions: University of Jinan, Shandong Jianzhu University
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2801259191