Wafer quality monitoring using spatial Dirichlet process based mixed-effect profile modeling scheme
Year: 2018
Type: article
Source: Journal of Manufacturing Systems
Authors: Jia Peter Liu, Ran Jin, Zhenyu James Kong
Institutions: Turner Broadcasting System (United States), Virginia Tech
Language: English
Subfield: Statistics, Probability and Uncertainty
Field: Decision Sciences
Domain: Social Sciences
Open Access status: closed
OpenAlex ID: W2808317395