Work

Anomalous diffusion along metal/ceramic interfaces

Year: 2018
Type: article
Abstract: Interface diffusion along a metal/ceramic interface present in numerous energy and electronic devices can critically affect their performance and stability. Hole formation in a polycrystalline Ni film on an α -Al 2 O 3 substrate coupled with a continuum diffusion analysis demonstrates that Ni diffusion along the Ni/ α -Al 2 O 3 interface is surprisingly fast. Ab initio calculations demonstrate that both Ni vacancy formation and migration energies at the coherent Ni/ α -Al 2 O 3 interface are much smaller than in bulk Ni, suggesting that the activation energy for diffusion along coherent Ni/ α -Al 2 O 3 interfaces is comparable to that along (incoherent/high angle) grain boundaries. Based on these results, we develop a simple model for diffusion along metal/ceramic interfaces, apply it to a wide range of metal/ceramic systems and validate it with several ab initio calculations. These results suggest that fast metal diffusion along metal/ceramic interfaces should be common, but is not universal.
Authors: Aakash Kumar, Hagit Barda, Leonid Klinger, Michael W. Finnis, Vincenzo Lordi, Eugen Rabkin, David J. Srolovitz
Language: English
Open Access status: gold
Estimated APC paid: $6,990
OpenAlex ID: W2857923920
FWCI: 3.705
Cites: 62
Cited by: 86
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