Work

Micro-Bump Assignment for Efficient Routing on Re-Distribution Layer (RDL) in 3D-ICs

Year: 2017

Type: conference-paper

Source: IEEE India Conference

DOI: 10.1109/indicon.2017.8488149

Authors: Sabyasachee Banerjee, Subhashis Majumder, Saikat Basu, Bhargab B. Bhattacharya

Institutions: Heritage Institute of Technology, Indian Statistical Institute

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2897224793

FWCI:

Cites: 16

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Related to: 10