Work

Development of a wafer level packaging technology for high voltage applications

Year: 2018

Type: conference-paper

Source: Electronic System-Integration Technology Conference (ESTC)

DOI: 10.1109/estc.2018.8546496

Authors: Marion Volpert, Abdenacer Aitmani, Adrien Gasse, Brigitte Soulier, Patrick Peray, Aurelie Vandeneynde, Bertrand Chambion, David Henry Francois Levy, Frederic Mercier, Pamela Rueda, Vincent Beix, Thomas Lacave

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Laboratoire d'Électronique des Technologies de l'Information, Université Grenoble Alpes

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2902512407

FWCI:

Cites: 10

Cited by:

Related to: 10