Work

The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40- $\mu$ m Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly

Year: 2018

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2018.2883670

Authors: Seyong Lee, Jongho Park, Jae-Hyeong Park, Hanmin Lee, Sangmyung Shin, Youngsoon Kim, Woojeong Kim, Taejin Choi, Kyung-Wook Paik

Institutions: Korea Advanced Institute of Science and Technology, Doosan (South Korea)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2902963979

FWCI: 0.188

Cites: 20

Cited by: 4

Related to: 10