Work

Cu-Al interfacial formation and kinetic growth behavior during HTS reliability test

Year: 2018

Type: article

Source: Journal of Materials Processing Technology

DOI: 10.1016/j.jmatprotec.2018.12.012

Authors: Chien-Pan Liu, Shoou-Jinn Chang, Yen-Fu Liu, Wei-Shou Chen

Institution: National Cheng Kung University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2904729369

FWCI: 0.957

Cites: 59

Cited by: 38

Related to: 10