Scalable Liquid Metal Thin Line Patterning for Passive Electronic Components Using Soft Lithography
Year: 2016
Type: conference-paper
Abstract: This paper presents a size-scalable and residue-free liquid metal patterning technique for all-soft passive electronic components using soft lithography and gallium-based liquid metal (EGaIn, Eutectic Gallium-Indium Alloy).Using the proposed technique, uniform and smooth EGaIn lines with widths ranging from single micrometers to several millimeters are patterned on a PDMS mold at room temperature in ambient pressure.To highlight the process capabilities, the electrical characteristics of fabricated passive components, such as resistors, interdigitated capacitors, as well as vertical interconnects using flexible-through-PDMS vias (fTPVs) are investigated under bending and twisting deformation.
Authors: M. Kim, H. Alrowais, S. Pavlidis, O. Brand
Institution: Georgia Institute of Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W2927185141