Work

Through-silicon-via process development

Year: 2010

Type: report

Source: SMARTech Repository (Georgia Institute of Technology)

Authors: G. Casinovi, Farrokh Ayazi

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2941336164

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Related to: 10