Year: 2019
Type: article
Abstract: One of the most important challenges connected with the production of thermoelectric modules and their parts is the development of an appropriate joining technology. The produced junctions must be characterised not only by high mechanical strength and good adhesion but also by high electrical conductivity, high heat conductivity and, due to working conditions, by a long-term chemical and temperature stability. This paper presents the results of the investigation of a Bi 2 Te 3 /copper junction obtained using lead-free solders. We analyse and discuss junction properties and quality. To produce this connection via resistance soldering under pressure, a spark slasma sintering (SPS/FAST) apparatus was used. The properties of the samples (electrical conductivity and Seebeck coefficient) have been characterized and presented. The microstructure investigations and analysis of the element distribution are also presented.
Source: Journal of Electronic Materials
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $3,140
Awards: G1028192861, G4008703948, G6003514881
OpenAlex ID: W2941383295