Design and Optimization of Heterogeneous Manycore Systems Enabled by Emerging Interconnect Technologies: Promises and Challenges
Year: 2019
Type: conference-paper
Institutions: Washington State University, Colorado State University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2945618131