Work

Ceramic Packages for Acoustically Coupled Neural Implants

Year: 2019

Type: conference-paper

Source: International IEEE/EMBS Conference on Neural Engineering

DOI: 10.1109/ner.2019.8716923

Authors: Konlin Shen, Michel M. Maharbiz

Institutions: University of California, San Francisco, University of California, Berkeley

Language: English

Topic: Neuroscience and Neural Engineering

Subfield: Cellular and Molecular Neuroscience

Field: Neuroscience

Domain: Life Sciences

Open Access status: closed

Funder: National Science Foundation

OpenAlex ID: W2945801775

FWCI: 9

Cites: 18

Cited by: 11

Related to: 10