Work

Low Temperature Joining and High Temperature Application of Segmented Half Heusler/Skutterudite Thermoelectric Joints

Year: 2019

Type: article

Abstract: A low temperature joining process has been developed to fabricate segmented half Heusler/skutterudite thermoelectric joints, and high temperature service behavior of the joints has been studied. The microstructure and electrical resistance across the joint before and after aging were investigated. The joint is well bonded and no cracks appear at the interfaces of the joint before and after aging, which can attribute to the formation of high melting point intermetallic compounds. The electrical resistance crosses the bonding layer smoothly and the contact resistance is low. These results show the process is effective, and promising for preparation of segmented thermoelectric devices.

Source: Materials

DOI: 10.3390/ma13010155

Authors: Weian Wang, Xiaoya Li, Ming Gu, Yunfei Xing, Yefeng Bao

Institutions: Hohai University, Chinese Academy of Sciences, Shanghai Institute of Ceramics, State Key Laboratory of High Performance Ceramics and Superfine Microstructure

Language: English

Topic: Advanced Thermoelectric Materials and Devices

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $1,824

Funder: National Natural Science Foundation of China