Work

Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers

Year: 2014

Type: conference-paper

Source: Fraunhofer-Publica (Fraunhofer-Gesellschaft)

Authors: Jacek Rudzki, Martin Becker, R. Eisele, Max Poech, Frank Osterwald

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2946526495

FWCI: 5.219

Cites:

Cited by: 33

Related to: 10