Work

Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process

Year: 2019

Type: article

Source: Metals and Materials International

DOI: 10.1007/s12540-019-00333-z

Authors: Fu-an Hua, Hong-wu Song, Tao Sun, Jian-ping Li

Institutions: Northeastern University, Chinese Academy of Sciences, Institute of Metal Research

Language: English

Topic: Advanced Welding Techniques Analysis

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Fundamental Research Funds for the Central Universities

Awards: G3461081090, G3641113484, 超薄铜铝复合电缆带累积轧制过程中的界面演化机制及力学性能控制研究

OpenAlex ID: W2954212994

FWCI: 0.563

Cites: 23

Cited by: 14

Related to: 10