Work

Interfacial bonding mechanism and pouring temperature effect on Al/Cu bimetal prepared by a novel compound casting process

Year: 2019

Type: article

Source: Materials Research Express

DOI: 10.1088/2053-1591/ab2d8f

Authors: Feng Guan, Wenming Jiang, Guangyu Li, Haixiao Jiang, Junwen Zhu, Zitian Fan

Institutions: State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology

Language: English

Topic: Advanced Welding Techniques Analysis

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Natural Science Foundation of Hubei Province

Award: G8795570351

OpenAlex ID: W2955416618

FWCI: 0.845

Cites: 29

Cited by: 20

Related to: 10