Work

Highly efficient planarization of sliced 4H–SiC (0001) wafer by slurryless electrochemical mechanical polishing

Year: 2019

Type: article

Source: International Journal of Machine Tools and Manufacture

DOI: 10.1016/j.ijmachtools.2019.103431

Authors: Xu Yang, Xiaozhe Yang, Kentaro Kawai, Kenta Arima, Kazuya Yamamura

Institution: The University of Osaka

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Machine Tool Engineering Foundation, Ministry of Education, Culture, Sports, Science and Technology, Japan Society for the Promotion of Science

Awards: Highly efficient slurryless finishing of difficult-to-polish materials by active controlled electrochemical mechanical polishing, G7942969752

OpenAlex ID: W2955635919

FWCI: 2.49

Cites: 25

Cited by: 112

Related to: 10