Work

The role of impurities on the reliability of Cu interconnects - A challenge for advanced packaging solutions

Year: 2019

Type: conference-paper

Source: International Workshop on Junction Technology

DOI: 10.23919/iwjt.2019.8802897

Authors: Thomas Beck, Bernd Roelfs

Institution: Atotech (Germany)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2969498751

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