Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
Work
Year: 2019
Type: article
Abstract: Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrate... more
Source: Materials & Design
Institutions Osaka University, National Cheng Kung University
Cites: 37
Cited by: 75
Related to: 10
FWCI: 3.468
Citation percentile (by year/subfield): 82.92
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Sustainable Development Goal Affordable and clean energy
Open Access status: gold
APC paid (est): $2,000