Molecular Dynamics (MD) Simulation of a Polymer Composite Matrix with Varying Degree of Moisture: Investigation of Secondary Bonding Interactions
Year: 2019
Type: conference-paper
DOI: 10.12783/asc34/31367
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2980569187
