Work

Grain nucleation and growth behavior of (Cu, Ni)6Sn5 in Sn–10Cu–1Ni alloy under pulse current: An in situ observation

Year: 2019

Type: article

Source: Materials Characterization

DOI: 10.1016/j.matchar.2019.109969

Authors: Bingyang Gao, Enyu Guo, Xiangrui Meng, Shuang Nie, Hui Liang, Zhiqiang Cao, Tongmin Wang

Institutions: Dalian University of Technology, Key Laboratory of Materials Modification by Laser, Ion and Electron Beams

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China, National Key Research and Development Program of China Stem Cell and Translational Research

Awards: G1924407324, G3047705598, G3433161111, G6323954094, Cu-Ni基合金的微结构设计、热电性能优化及强化机制研究, G7782335872, G8704818321

OpenAlex ID: W2981118372

FWCI: 0.359

Cites: 32

Cited by: 5

Related to: 10