Work

Preparation of n-type Bi-Te-Se-based Thermoelectric Materials with Improved Reliability via hot Extrusion Process

Year: 2019

Type: article

Source: Journal of the Microelectronics and Packaging Society

DOI: 10.6117/kmeps.2019.26.2.0045

Authors: HwangJeongYun, Yongnam Kim, Kyu Hyoung Lee

Language: English

Topic: Advanced Thermoelectric Materials and Devices

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: diamond

OpenAlex ID: W2995419300

FWCI:

Cites: 2

Cited by: 2

Related to: 10