Work

Kinetic study of disulfide molecular film deposition for Cu-EMC adhesion promotion

Year: 2006

Type: article

Authors: Cell K. Y. Wong, Min Zheng, Bing Xu, Matthew Ming Fai Yuen

Institution: Hong Kong University of Science and Technology

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3006491908

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