Work

Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations

Year: 2019

Type: conference-paper

Source: International 3D Systems Integration Conference (3DIC)

DOI: 10.1109/3dic48104.2019.9058793

Authors: O. Billoint, K. Azizi-Mourier, G. Cibrario, D. Lattard, M. Mouhdach, S. Thuries, P. Vivet

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W3015382034

FWCI: 1.21

Cites: 10

Cited by: 3

Related to: 10