Preface to the Special Issue on Flexible Materials and Structures for Bioengineering, Sensing, and Energy Applications
Year: 2020
Type: editorial
Abstract: fabrication of micro-/nanostructured polydimethylsiloxanes and their soft electronic applications Donghwi Cho, Junyong Park, Taehoon Kim et al.
Source: Journal of Semiconductors
Authors: Yongfeng Mei, Wei Gao, Hui Fang, Yuan Lin, Guozhen Shen
Institutions: Fudan University, State Key Laboratory of ASIC and System, California Institute of Technology, Northeastern University, University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Films and Integrated Devices, Chinese Academy of Sciences, Institute of Semiconductors
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W3020423518