Work

Voiding Mechanism in BGA Assembly

Year: 1995

Type: article

Authors: Ning-Cheng Lee, Wanda B. O'Hara

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3025363527

FWCI:

Cites:

Cited by: 9

Related to: 10