Work

Wire Bonding Interconnects with Package CAD Data

Year: 1995

Type: book-chapter

Source: SPIE eBooks

Authors: H. Anderson, Arijit Chandra, Dzung L. Pham, Cubes Niones, Maria Foley

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3028098242

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