Work

Predicting solder defects in printed circuit board assembly (PCBA) process

Year: 2019
Type: dissertation
Abstract: Thesis: M.B.A., Massachusetts Institute of Technology, Sloan School of Management, 2019, In conjunction with the Leaders for Global Operations Program at MIT
Language: English
Open Access status: green
OpenAlex ID: W3035879475
Cites: 11
Cited by:
Related to: 10