Work

Ultra low profile thin film capacitor for high performance electronic packages

Year: 2020

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc32862.2020.00073

Authors: Kenichi Yoshida, Hitoshi Saita, Takashi Kariya

Institution: TDK (Japan)

Language: English

Topic: Ferroelectric and Piezoelectric Materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W3048082891

FWCI: 5.412

Cites: 3

Cited by: 7

Related to: 10