Work

Intermetallic Compounds at the Interfaces of Ag–Pd Alloy Stud Bumps With Al Pads

Year: 2020

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2020.3023943

Authors: Tung-Han Chuang, Shih-Wen Hsu, Chun-Hao Chen

Institution: National Taiwan University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Ministry of Science and Technology, Taiwan

Award: Study on the Materials Characteristics and Grain Structure for the Rolling and Annealing of Ag-Alloy Ribbons( II )

OpenAlex ID: W3085652561

FWCI: 0.688

Cites: 47

Cited by: 11

Related to: 10