Work

Simulation Study on Thermal Mechanical Properties of Different Embedded Packaging Structures and Materials of GaN Devices

Year: 2020

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept50128.2020.9202912

Authors: Chenwei Zhang, Xu Liu, Jun Li, Guanqiang Song, Huaiyu Ye

Institutions: Southern University of Science and Technology, Delft University of Technology

Language: English

Topic: GaN-based semiconductor devices and materials

Subfield: Condensed Matter Physics

Field: Physics and Astronomy

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3088750800

FWCI: 2.418

Cites: 5

Cited by: 10

Related to: 10