Work

Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip

Year: 2020

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2020.3031670

Authors: Dongjin Kim, Shijo Nagao, Chuantong Chen, Naoki Wakasugi, Yasuyuki Yamamoto, Aiji Suetake, Tetsu Takemasa, Tohru Sugahara, Katsuaki Suganuma

Institutions: The Institute of Scientific and Industrial Research, The University of Osaka, The University of Osaka, Yamato Scientific Co., Ltd. (Japan), Tokuyama (Japan)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funder: New Energy and Industrial Technology Development Organization

OpenAlex ID: W3093584293

FWCI: 3.267

Cites: 82

Cited by: 87

Related to: 10