Work

Metal Slice Defect Induced Package Level Reliability Failure

Year: 2006

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2006p0457

Authors: Mark Zhang, Scott Liao, Sanan Liang, Ricky Lou, Rock Chen, Chorng Niou, W.T. Kary Chien

Institution: Semiconductor Manufacturing International (China)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3112980266

FWCI:

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