Work

Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis and Microcharacterization

Year: 2000

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2000p0011

Authors: W-K Wong, J.T.L. Thong, J.C.H. Phang, Q.R. Yin, J.W. Fang

Institutions: Institute of Materials Research and Engineering, National University of Singapore, Shanghai Institute of Ceramics

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3117078255

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