Year: 1996
Type: conference-paper
Abstract: This paper presents a practical microassembly process for the realization of three-dimensional (3D) microelectrode arrays for recording and stimulation in the central nervous system (CNS).Several two-dimensional silicon probes are positioned in a surface platform and held parallel using micromachined spacers.Lead transfers between the probes and the platform are formed using gold beams on the probes that are attached to the platform using ultrasonic bonding with a wire-free wedge.The low-profile (150µm) outrigger design of the probes allows the bonding of fully-assembled high-density arrays.Arrays having 8xl6-shanks on 200µm centers have been realized and used to record from cortical single units with interelectrode capacitances of less than lfF, corresponding to on-chip crosstalk below 0.01 percent.Micromachined tools allow full array assembly in 30 minutes.
Authors: Q. Bai, K. D
Institution: University of Michigan
Language: English
Subfield: Cellular and Molecular Neuroscience
Field: Neuroscience
Domain: Life Sciences
Open Access status: hybrid
OpenAlex ID: W3119448270