Work

Low temperature sinter technology die attachment for power electronic applications

Year: 2010

Type: conference-paper

Source: International Conference on Integrated Power Electronics Systems (CIPS)

Authors: Christian Gobl, J. Faltenbacher

Institution: Semikron (Germany)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W2165842238

FWCI: 20.53

Cites: 1

Cited by: 155

Related to: 10