System-level cost analysis and design exploration for three-dimensional integrated circuits (3D ICs)
Year: 2009
Type: conference-paper
Authors: Xiangyu Dong, Yuan Xie
Institution: Pennsylvania State University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: National Science Foundation
OpenAlex ID: W3148440458