Work

Low temperature joining technology - a high reliability alternative to solder contacts

Year: 1997

Type: article

Source: OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)

Authors: Uwe Scheuermann, P Wiedl

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W3165060621

FWCI:

Cites:

Cited by: 46

Related to: 10