Work

A Concurrent Enhancement of Both In‐Plane and Through‐Plane Thermal Conductivity of Injection Molded Polycarbonate/Boron Nitride/Alumina Composites by Constructing a Dense Filler Packing Structure

Year: 2021

Type: article

Source: Macromolecular Materials and Engineering

DOI: 10.1002/mame.202100267

Authors: Yang Bai, You Shi, Shengtai Zhou, Huawei Zou, Mei Liang

Institutions: Sichuan University, State Key Laboratory of Polymer Materials Engineering

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: Postdoctoral Research Foundation of China

Award: G7215211430

OpenAlex ID: W3166240002

FWCI: 2.023

Cites: 51

Cited by: 37

Related to: 10