Work

Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging

Year: 2021

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc32696.2021.00304

Authors: Xu Liu, Quan Zhou, Xu Zhao, Sau Wee Koh, Huaiyu Ye, Guoqi Zhang

Institutions: Delft University of Technology, Chongqing University, Huawei Technologies (China), Southern University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W3190073289

FWCI: 2.312

Cites: 5

Cited by: 11

Related to: 10