Work

Plasma Etching Pre-treatment for a TEM Lamella Preparation of 3D NAND with High Aspect Ratio

Year: 2021

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2021p0141

Authors: Yu-Chih Chen, Bing-Chang Li, Pei-Ling Hsu, Tsung-Yi Lin, I-An Chen, Chun-Hung Lin, Hsin-Cheng Hsu, Chin-Chih Yeh, Nan-Tzu Lian, Ta-Hone Yang, Kuang-Chao Chen

Institution: Macronix International (Taiwan)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3194589879

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